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28 February 2017 Investigation of grinding parameters and machine dynamic characteristics' effect towards brittle material subsurface damage
B. Li, Y. Y. Wu, J. P. Xi, D. X. Ren, Z. X. Zhao
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Proceedings Volume 10256, Second International Conference on Photonics and Optical Engineering; 102562N (2017) https://doi.org/10.1117/12.2257480
Event: Second International Conference on Photonics and Optical Engineering, 2016, Xi'an, China
Abstract
Elements performance is greatly affected by their surface and subsurface integrity, especially for the brittle material. Prediction model of the subsurface damage would provide the insight into the grinding parameters effects and better control of them. In this paper, based on the classic brittle solid crack theory, prediction model of brittle material subsurface damage induced by brittle mode diamond grinding was established. Firstly, contact area calculation was modeled to estimate the involved grits number using the grit density. Based on the prediction model, grinding parameters effects were investigated. Finally, grinding machine stiffness, accuracy and damping coefficients were introduced to quantitatively analyze their effects towards subsurface damage. The proposed model would promote more definite control of grinding induced subsurface damage and optimal design of the grinding machine dynamic characteristics.
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B. Li, Y. Y. Wu, J. P. Xi, D. X. Ren, and Z. X. Zhao "Investigation of grinding parameters and machine dynamic characteristics' effect towards brittle material subsurface damage", Proc. SPIE 10256, Second International Conference on Photonics and Optical Engineering, 102562N (28 February 2017); https://doi.org/10.1117/12.2257480
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KEYWORDS
Diamond
Lens grinding equipment
Kinematics
Solids
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