Enhanced terahertz imaging of electronic packaging materials with deconvolution algorithm

Chan Zheng; Zheyu Song; Shihan Yan; Jingbo Liu; Dongxiong Ling; Dongshan Wei; Jinyun Zhou

doi:10.1117/12.2547637

12 March 2020 Enhanced terahertz imaging of electronic packaging materials with deconvolution algorithm

Chan Zheng, Zheyu Song, Shihan Yan, Jingbo Liu, Dongxiong Ling, Dongshan Wei, Jinyun Zhou

Proceedings Volume 11441, 2019 International Conference on Optical Instruments and Technology: IRMMW-THz Technologies and Applications; 114410D (2020) https://doi.org/10.1117/12.2547637
Event: 2019 International Conference on Optical Instruments and Technology, 2019, Beijing, China

Abstract

This paper proposes the deconvolution image restoration algorithm, which uses the point spread function constructed by the physical characteristics of the terahertz beam to reconstruct the terahertz image and improve the image resolution[1]. At the same time, by constructing a point spread function with different penetration depths in the sample, the effect of image chromatogram on the sample can also be achieved. The integrated circuit (IC) electronic package terahertz imaging results clearly show the spatial position of the pins, internal chips and defects of the electronic packages, and analyze a variety of failure defect types, which are <1% more than the actual size.

Citation Download Citation

Chan Zheng, Zheyu Song, Shihan Yan, Jingbo Liu, Dongxiong Ling, Dongshan Wei, and Jinyun Zhou "Enhanced terahertz imaging of electronic packaging materials with deconvolution algorithm", Proc. SPIE 11441, 2019 International Conference on Optical Instruments and Technology: IRMMW-THz Technologies and Applications, 114410D (12 March 2020); https://doi.org/10.1117/12.2547637

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