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Dr. Dongshan Wei
at Dongguan Univ of Technology
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Publications (1)
Proceedings Article | 12 March 2020 Paper
Enhanced terahertz imaging of electronic packaging materials with deconvolution algorithm
Chan Zheng, Zheyu Song, Shihan Yan, Jingbo Liu, Dongxiong Ling, Dongshan Wei, Jinyun Zhou
Proceedings Volume 11441, 114410D (2020) https://doi.org/10.1117/12.2547637
KEYWORDS: Packaging, Millimeter wave imaging, Electronic imaging, Deconvolution, Electronic components, Microwave radiation, Reliability, Interfaces, Nondestructive evaluation, Terahertz radiation
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