Paper
22 February 2021 Direct laser writing on silicon surface for large area nanoplasmonic devices
Author Affiliations +
Abstract
The present work use direct laser writing (DLW) system for fabrication of large area patterning of microstructures. Micro sized square pattern of 1μm size with 2μm spacing were successfully fabricated on 1500 x 1500 μm2 large area Si substrate. The developed microstructures found potential application in colloidal nanotweezers manipulation of plasmonic devices. The results shows precision in large scale micro patterning using DLW system and claimed a faster and simple process in patterning microstructure compared to electron beam (e-beam) lithography process. The developed micro patterning are dry etched using RIE to convert SiO2 pillar of 500 nm height with tip diameter of 250 nm to fabricate the helical structures which found potential applications in nanoplasmonic devices.
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Akshdeep Sharma, Bhargav G., Ajay Kaushal, K. N. Bhat, and Ambarish Ghosh "Direct laser writing on silicon surface for large area nanoplasmonic devices", Proc. SPIE 11610, Novel Patterning Technologies 2021, 116100I (22 February 2021); https://doi.org/10.1117/12.2583823
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KEYWORDS
Silicon

Multiphoton lithography

Nanoplasmonics

Semiconductor lasers

Photomicroscopy

Plasmonics

Reactive ion etching

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