The unfolding road from dust to trust

Valeriu Beiu

doi:10.1117/12.2601821

5 May 2022 The unfolding road from dust to trust

Valeriu Beiu

Proceedings Volume 12170, Advances in 3OM: Opto-Mechatronics, Opto-Mechanics, and Optical Metrology; 1217007 (2022) https://doi.org/10.1117/12.2601821
Event: Advances in 3OM: Opto-Mechatronics, Opto-Mechanics, and Optical Metrology, 2021, Timisoara, Romania

Abstract

This paper will start by mentioning some of the most advanced reflective optics for telescopes, weighting them against those of advanced EUV lithography, and going on to advocate for a reliability approach (trust) bridging technology (including EUV lithography) and system design for advanced CMOS silicon technology (dust). Focusing on the (un)reliability of nanometer transistors, the fact that chips fabricated in 5nm CMOS silicon technology require EUV tools which use holistic lithographic approaches is indirectly making the case for the potential of a much closer integration of circuit design with technology (currently only mildly connected), under a holistic design umbrella.

Citation Download Citation

Valeriu Beiu "The unfolding road from dust to trust", Proc. SPIE 12170, Advances in 3OM: Opto-Mechatronics, Opto-Mechanics, and Optical Metrology, 1217007 (5 May 2022); https://doi.org/10.1117/12.2601821

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