Presentation + Paper
13 March 2023 A fully packaged silicon photonic Bragg grating temperature sensor with a compact back side interface based on a ball lens
Author Affiliations +
Proceedings Volume 12426, Silicon Photonics XVIII; 124260F (2023) https://doi.org/10.1117/12.2647381
Event: SPIE OPTO, 2023, San Francisco, California, United States
Abstract
With the increased interest in silicon photonics, smart integration and packaging technologies are essential to transform photonic integrated circuits (PICs) into functional photonic systems. Especially for sensing, the currently existing standard packaging technologies are too expensive and bulky. We developed a solution for integrating a 1 mm x 1 mm sensor PIC with a single mode fiber and packaging it in a 1.5 mm inner-diameter metal protective tube. The concept relies on interfacing a grating coupler with a fiber from the back side of the PIC employing a 300 μm ball lens mounted in a laser-fabricated fused silica precision holder. It is shown that the additional insertion loss caused by the ball lens interface is very limited. A packaged sensor was achieved by sequentially mounting the holder on a ceramic ferrule, then the PIC on the holder and finally gluing a metal tube surrounding the assembly, taking care that the PIC surface is flush with the end face of the tube. The back side fiber interface ensures that the PIC’s surface remains accessible for sensing, while the tube protects the fiber-to-PIC interface. We demonstrated this concept by realizing a packaged phase shifted silicon Bragg grating temperature sensor operating around 1550 nm, which could be read out in reflection using a commercial interrogator. A temperature sensitivity of 73 pm/°C was found, and we demonstrated sensor functionality up to 180°C.
Conference Presentation
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jeroen Missinne, Viktor Geudens, Steven Van Put, Giannis Poulopoulos, Michal Szaj, George Syriopoulos, Charalampos Zervos, Hercules Avramopoulos, and Geert Van Steenberge "A fully packaged silicon photonic Bragg grating temperature sensor with a compact back side interface based on a ball lens", Proc. SPIE 12426, Silicon Photonics XVIII, 124260F (13 March 2023); https://doi.org/10.1117/12.2647381
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KEYWORDS
Photonic integrated circuits

Sensors

Interfaces

Bragg gratings

Reflection

Optical gratings

Semiconducting wafers

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