Paper
5 October 2023 Emergence of next generation EUV optics: status, outlook and future
Daniel Golde, Björn Butscher, Paul Gräupner, Peter Kürz, Dirk Jürgens, Olaf Conradi, Jan van Schoot, Judon Stoeldraijer
Author Affiliations +
Proceedings Volume 12802, 38th European Mask and Lithography Conference (EMLC 2023); 1280202 (2023) https://doi.org/10.1117/12.2673952
Event: 38th European Mask and Lithography Conference, 2023, Dresden, Germany
Abstract
With already more than 160 EUV scanners operational worldwide, the promise of EUV lithography became a high-volume-manufacturing reality in the past few years. Moreover, EUV lithography has now become the main enabler for the latest generations of chips we all know and use. ZEISS and ASML keep on developing the capability of EUV tools to further enable upcoming generations of chips. The next step is an increase of the numerical aperture (NA) of our optics from currently 0.33 to 0.55. These high-NA tools will support the shrink prescribed by Moore's Law to continue well into the next decade, by allowing lithographers to print 8nm half-pitch in a single exposure. We will give an update on the current production status at ZEISS: not only on mirror surface polishing, coating, metrology, but also on mirror handling and integration. Moreover, we will also present the current status and prospects of 0.33-NA optics.
(2023) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Daniel Golde, Björn Butscher, Paul Gräupner, Peter Kürz, Dirk Jürgens, Olaf Conradi, Jan van Schoot, and Judon Stoeldraijer "Emergence of next generation EUV optics: status, outlook and future", Proc. SPIE 12802, 38th European Mask and Lithography Conference (EMLC 2023), 1280202 (5 October 2023); https://doi.org/10.1117/12.2673952
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KEYWORDS
Mirrors

Extreme ultraviolet

Design and modelling

EUV optics

Extreme ultraviolet lithography

Semiconducting wafers

Manufacturing

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