Open Access Paper
26 April 2024 Front Matter: Volume 12954
Abstract
This PDF file contains the front matter associated with SPIE Proceedings Volume 12954, including the Title Page, Copyright information, Table of Contents, and Conference Committee information.

The papers in this volume were part of the technical conference cited on the cover and title page. Papers were selected and subject to review by the editors and conference program committee. Some conference presentations may not be available for publication. Additional papers and presentation recordings may be available online in the SPIE Digital Library at SPIEDigitalLibrary.org.

The papers reflect the work and thoughts of the authors and are published herein as submitted. The publisher is not responsible for the validity of the information or for any outcomes resulting from reliance thereon.

Please use the following format to cite material from these proceedings:

Author(s), “Title of Paper,” in DTCO and Computational Patterning III, edited by Neal V. Lafferty, Proc. of SPIE 12954, Seven-digit Article CID Number (DD/MM/YYYY); (DOI URL).

ISSN: 0277-786X

ISSN: 1996-756X (electronic)

ISBN: 9781510672147

ISBN: 9781510672154 (electronic)

Published by

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Copyright © 2024 Society of Photo-Optical Instrumentation Engineers (SPIE).

Copying of material in this book for internal or personal use, or for the internal or personal use of specific clients, beyond the fair use provisions granted by the U.S. Copyright Law is authorized by SPIE subject to payment of fees. To obtain permission to use and share articles in this volume, visit Copyright Clearance Center at copyright.com. Other copying for republication, resale, advertising or promotion, or any form of systematic or multiple reproduction of any material in this book is prohibited except with permission in writing from the publisher.

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Paper Numbering: A unique citation identifier (CID) number is assigned to each article in the Proceedings of SPIE at the time of publication. Utilization of CIDs allows articles to be fully citable as soon as they are published online, and connects the same identifier to all online and print versions of the publication. SPIE uses a seven-digit CID article numbering system structured as follows:

  • The first five digits correspond to the SPIE volume number.

  • The last two digits indicate publication order within the volume using a Base 36 numbering system employing both numerals and letters. These two-number sets start with 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, 0A, 0B … 0Z, followed by 10-1Z, 20-2Z, etc. The CID Number appears on each page of the manuscript.

Conference Committee

Symposium Chair

  • Qinghuang Lin, Linktech, Inc. (United States)

Symposium Co-chair

  • John C. Robinson, KLA Corporation (United States)

Conference Chair

  • Neal V. Lafferty, Siemens EDA (United States)

Conference Co-chair

  • Harsha Grunes, Intel Corporation (United States)

Conference Program Committee

  • Jason P. Cain, Advanced Micro Devices, Inc. (United States)

  • Luigi Capodieci, Motivo, Inc. (United States)

  • Lifu Chang, MOSIS Integrated Circuit Fabrication Service (United States)

  • Dan J. Dechene, IBM Thomas J. Watson Research Center (United States)

  • David M. Fried, Lam Research Corporation (United States)

  • Yuri Granik, Siemens EDA (United States)

  • Srividya Jayaram, Siemens EDA (United States)

  • Seongtae Jeong, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)

  • Ryoung-Han Kim, imec (Belgium)

  • Sachiko Kobayashi, KIOXIA Corporation (Japan)

  • Kafai Lai, The University of Hong Kong (Hong Kong, China)

  • Ya-Chieh Lai, Cadence Design Systems, Inc. (United States)

  • Lars W. Liebmann, Intel Corporation (United States)

  • Kevin Lucas, Synopsys, Inc. (United States)

  • Lawrence S. Melvin III, Synopsys, Inc. (United States)

  • Shigeki Nojima, KIOXIA Corporation (Japan)

  • David Z. Pan, The University of Texas at Austin (United States)

  • Piyush Pathak, Cadence Design Systems, Inc. (United States)

  • Michael L. Rieger, Consultant (United States)

  • Vivek K. Singh, NVIDIA Corporation (United States)

  • Chun-Ming Wang, Western Digital Corporation (United States)

  • Lynn T. Wang, GlobalFoundries (United States)

  • Yayi Wei, Institute of Microelectronics, Chinese Academy of Sciences (China)

  • Chi-Min Yuan, NXP Semiconductors (United States)

© (2024) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
"Front Matter: Volume 12954", Proc. SPIE 12954, DTCO and Computational Patterning III, 1295401 (26 April 2024); https://doi.org/10.1117/12.3031866
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KEYWORDS
Data modeling

Machine learning

Optical proximity correction

Image processing

Instrument modeling

Lithography

Optical lithography

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