Fabrication of superconducting quantum circuits on 12-inch wafers using an ArF immersion lithography system Ⅱ

Satoru Odate; Naooki Saito; Hajime Aoyama; Koichi Kusuyama; Yasunobu Nakamura; Hiroyuki Tsukamoto

doi:10.1117/12.3027297

4 October 2024 Fabrication of superconducting quantum circuits on 12-inch wafers using an ArF immersion lithography system Ⅱ

Satoru Odate, Naooki Saito, Hajime Aoyama, Koichi Kusuyama, Yasunobu Nakamura, Hiroyuki Tsukamoto

Author Affiliations +

Proceedings Volume 13115, UV and Higher Energy Photonics: From Materials to Applications 2024; 1311508 (2024) https://doi.org/10.1117/12.3027297
Event: Nanoscience + Engineering, 2024, San Diego, California, United States

Abstract

We report on advances in the fabrication of Josephson junctions, crucial devices in superconducting quantum circuits. In our previous work, we successfully fabricated these on 12-inch substrates using ArF immersion lithography. To enable future large-scale production, we are moving towards sputtering and dry etching techniques. After initial successful tests on a 4-inch substrate, we have now verified this process on 12-inch substrate fabrication equipment, marking significant progress despite the challenges we have faced.

Conference Presentation

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Satoru Odate, Naooki Saito, Hajime Aoyama, Koichi Kusuyama, Yasunobu Nakamura, and Hiroyuki Tsukamoto "Fabrication of superconducting quantum circuits on 12-inch wafers using an ArF immersion lithography system Ⅱ", Proc. SPIE 13115, UV and Higher Energy Photonics: From Materials to Applications 2024, 1311508 (4 October 2024); https://doi.org/10.1117/12.3027297

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