Material property measurements with post-processed thermal image data

Christopher S. Welch; William P. Winfree; D. Michele Heath; K. Elliott Cramer; Patricia A. Howell

doi:10.1117/12.21921

1 March 1990 Material property measurements with post-processed thermal image data

Christopher S. Welch, William P. Winfree, D. Michele Heath, K. Elliott Cramer, Patricia A. Howell

Proceedings Volume 1313, Thermosense XII: An International Conference on Thermal Sensing and Imaging Diagnostic Applications; (1990) https://doi.org/10.1117/12.21921
Event: 1990 Technical Symposium on Optics, Electro-Optics, and Sensors, 1990, Orlando, FL, United States

Abstract

Post-processing of infrared thermal image thta is a technique which finds many uses in a laboratory devoted to non-destructhe evaluation (NDE) of materials. Among these are determination ofmaterial pmperty values and detection/location of delaminations. Exanples are shown in which thermal diffusivity is measured for technique verification, as a verification of the tensor nature of diffusivity measurements and as a proxy for porosity in a test sample of a material under developmenL Another example is given in which the coefficient of thennal expansion is determined through the phenomenon of thermoelasticity. A final example is given in which post-processing extrts the thermal signature of a delamination from an image dominated by an unwanted feature. Following these examples of materials evaluation using post-processing, a set of procedures common to the data analysis in the examples is extracted. Generic requirements are given so that each procedure can operate consistently within the entire process to produce appropriate values of the material characteristics sought.

Citation Download Citation

Christopher S. Welch, William P. Winfree, D. Michele Heath, K. Elliott Cramer, and Patricia A. Howell "Material property measurements with post-processed thermal image data", Proc. SPIE 1313, Thermosense XII: An International Conference on Thermal Sensing and Imaging Diagnostic Applications, (1 March 1990); https://doi.org/10.1117/12.21921

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