Noncontacting acoustics-based temperature measurement techniques in rapid thermal processing

Yong Jin Lee; Ching-Hua Chou; Butrus T. Khuri-Yakub; Krishna C. Saraswat

doi:10.1117/12.25719

1 April 1991 Noncontacting acoustics-based temperature measurement techniques in rapid thermal processing

Yong Jin Lee, Ching-Hua Chou, Butrus T. Khuri-Yakub, Krishna C. Saraswat

Proceedings Volume 1393, Rapid Thermal and Related Processing Techniques; (1991) https://doi.org/10.1117/12.25719
Event: Processing Integration, 1990, Santa Clara, CA, United States

Abstract

Temperature measurement of silicon wafers based on the temperature dependence of acoustic waves is studied. The change in the temperature-dependent dispersion relations of the plate modes through the wafer can be exploited to provide a viable temperature monitoring scheme with advantages over both thermocouples and pyrometers. Velocity measurements of acoustic waves through a thin layer of ambient directly above the wafer provides the temperature of the wafer-ambient interface. 1.

Citation Download Citation

Yong Jin Lee, Ching-Hua Chou, Butrus T. Khuri-Yakub, and Krishna C. Saraswat "Noncontacting acoustics-based temperature measurement techniques in rapid thermal processing", Proc. SPIE 1393, Rapid Thermal and Related Processing Techniques, (1 April 1991); https://doi.org/10.1117/12.25719

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