Paper
1 December 1992 A microchannel heat sink with alternating directions of water flow in adjacent channels
L. J. Missaggia
Author Affiliations +
Abstract
A microchannel heat sink design, with alternating directions of coolant flow in adjacent channels, yields improved uniformity in thermal resistance. A thermal resistance of 0.1 1°C cm2/W was demonstrated for a heated area < 2 cm2. With this design, comparable performance is feasible in channels up to 10 cm long with spatial variation in the resistance <6%.
© (1992) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
L. J. Missaggia "A microchannel heat sink with alternating directions of water flow in adjacent channels", Proc. SPIE 1582, Integrated Optoelectronics for Communication and Processing, (1 December 1992); https://doi.org/10.1117/12.2321791
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CITATIONS
Cited by 17 scholarly publications.
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KEYWORDS
Resistance

Heat flux

Optoelectronics

Silicon

Resistors

Semiconducting wafers

Temperature metrology

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