Evolution of MIMMI: a novel surface imaging resist based on metallic surface imaging of organic photoresists

Kenneth J. Radigan; Silvia Liddicoat

doi:10.1117/12.59739

1 June 1992 Evolution of MIMMI: a novel surface imaging resist based on metallic surface imaging of organic photoresists

Kenneth J. Radigan, Silvia Liddicoat

Author Affiliations +

Proceedings Volume 1672, Advances in Resist Technology and Processing IX; (1992) https://doi.org/10.1117/12.59739
Event: Microlithography '92, 1992, San Jose, CA, United States

Abstract

Depth of focus is known to decrease with short wavelengths of light or high numerical aperture lenses. With the advent of short wavelength ultraviolet sources (DUV - 248 nm, 213 nm & 193 nm), and high numerical aperture lenses (NA > .40), the depth of focus for imaging sub-micron features in single layer photoresist becomes an area of concern. Surface imaging resist (SIR), or top surface imaging (TSI) has been proposed as the solution to the diminishing depth of focus for lithography of single layer photoresists. The most commonly known form this technology has taken is the silylation of organic photoresists following exposure to an appropriate illuminating source. This technology has drawbacks in that the resulting silylated resist is not too much different chemically from many of the inorganic substrates that one wishes to pattern. This limits its applicability in use with fluorine containing plasmas. It also creates a film that is difficult to remove after the pattern transfer is accomplished. A developmental type of surface imaging system is currently being evaluated for its applicability as a photolithographical resist. MIMMITM (micro imaging with metal mask integration) uses an ultrathin metallic layer over conventionally applied and exposed photoresist. The film is shallowly developed and metallization is electrolessly applied to the remaining pattern. The metal pattern is further dry developed to complete its structure for image transfer. The metallized pattern is impervious to all commonly used plasma etch environments and is easily stripped in dilute acid and common organic solvents.

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Kenneth J. Radigan and Silvia Liddicoat "Evolution of MIMMI: a novel surface imaging resist based on metallic surface imaging of organic photoresists", Proc. SPIE 1672, Advances in Resist Technology and Processing IX, (1 June 1992); https://doi.org/10.1117/12.59739

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KEYWORDS

Photoresist materials

Plasmas

Photoresist developing

Semiconducting wafers

Etching

Nickel

Photoresist processing

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