Progression of overlay performance on a 0.5-NA broadband DUV wafer exposure system

Joseph C. Vigil; Gerald B. Elder; David J. Cronin; Stan Drazkiewicz; Timothy J. Wiltshire

doi:10.1117/12.175489

17 May 1994 Progression of overlay performance on a 0.5-NA broadband DUV wafer exposure system

Joseph C. Vigil, Gerald B. Elder, David J. Cronin, Stan Drazkiewicz, Timothy J. Wiltshire

Proceedings Volume 2197, Optical/Laser Microlithography VII; (1994) https://doi.org/10.1117/12.175489
Event: SPIE's 1994 Symposium on Microlithography, 1994, San Jose, CA, United States

Abstract

The MICRASCAN-II (MS-II) is a 0.50 NA DUV broadband illumination (245 nm to 252 nm) step-and-scan exposure system manufactured by Silicon Valley Group Lithography Systems, Inc. (SVGL) of Wilton, Connecticut. The system is designed to provide 350 nm resolution and 90 nm overlay in a semiconductor manufacturing environment. Overlay system improvements and performance testing have been made on pre-production and production versions of the MS-II. The MICRASCAN system has both a laser illuminated `through-the-lens' (TTL) and a broadband illuminated `off-axis alignment system' (OAAS). This paper summarizes the progression of system overlay improvements and the results of the tests conducted. Results from initial baseline tests pre and post system improvements on artifact wafers are presented. Product level data collected from marathon testing showing system performance on six individual product levels and areas for improvement are presented. Descriptions of an improved TTL alignment system and its attributes are provided. A description of a new and completely independent alignment system (OAAS) and its attributes are discussed.

Citation Download Citation

Joseph C. Vigil, Gerald B. Elder, David J. Cronin, Stan Drazkiewicz, and Timothy J. Wiltshire "Progression of overlay performance on a 0.5-NA broadband DUV wafer exposure system", Proc. SPIE 2197, Optical/Laser Microlithography VII, (17 May 1994); https://doi.org/10.1117/12.175489

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