Test structures for nondestructive in-situ control of the anodic bonding quality

Jose Antonio Plaza; Jaume Esteve; Emilio Lora-Tamayo

doi:10.1117/12.251216

23 September 1996 Test structures for nondestructive in-situ control of the anodic bonding quality

Jose Antonio Plaza, Jaume Esteve, Emilio Lora-Tamayo

Proceedings Volume 2879, Micromachining and Microfabrication Process Technology II; (1996) https://doi.org/10.1117/12.251216
Event: Micromachining and Microfabrication '96, 1996, Austin, TX, United States

Abstract

A simple anodic bonding test is presented. This test can be used to study the anodic bonding process or used to control the quality of processed wafers. The test consists of simple test structures that have been fabricated on the silicon wafer. In this way, small cavities with different dimension are defined by a single RIE process. The anodic bonding occurs as a consequence of the high level of electrostatic pressure applied during the process. The electrostatic pressure pulls the two surfaces of the cavity into intimate contact. Depending on the stiffness of the cavities, determined by their dimensions, they will be bonded or not. The bonding process and quality can be monitored by the measurement of the size of the smallest bonded cavity and the distance between the bonded area and the border of the cavity. The test has been validated by the study of the influence of the depth of the cavities and the influence of the geometry of the glass electrode. The test presented gives more information about the anodic bonding process than the other characterization techniques. Moreover, this electrostatic test is non-destructive, it is very easy to implement on processed wafers and no special set-up is needed for measurements. The new electrostatic anodic bonding test is very promising as a simple method to increase knowledge of the phenomena.

Citation Download Citation

Jose Antonio Plaza, Jaume Esteve, and Emilio Lora-Tamayo "Test structures for nondestructive in-situ control of the anodic bonding quality", Proc. SPIE 2879, Micromachining and Microfabrication Process Technology II, (23 September 1996); https://doi.org/10.1117/12.251216

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members: $17.00

Non-members: $21.00 ADD TO CART

PROCEEDINGS
9 PAGES

DOWNLOAD PAPER SAVE TO MY LIBRARY

GET CITATION

RIGHTS & PERMISSIONS

Get copyright permission Get copyright permission on Copyright Marketplace

KEYWORDS

Glasses

Semiconducting wafers

Silicon

Nondestructive evaluation

Electrodes

Visualization

Wafer bonding

Show All Keywords

Keywords/Phrases

Search In:

Publication Years