Precise micronanomachining for advanced sensors

Masayoshi Esashi; Takahito Ono; Kazuyuki Minami

doi:10.1117/12.284499

5 September 1997 Precise micronanomachining for advanced sensors

Masayoshi Esashi, Takahito Ono, Kazuyuki Minami

Proceedings Volume 3223, Micromachining and Microfabrication Process Technology III; (1997) https://doi.org/10.1117/12.284499
Event: Micromachining and Microfabrication, 1997, Austin, TX, United States

Abstract

Advanced silicon micro sensors for pressure, acceleration, angular rate, infrared radiation and atomic force have been developed based on bulk silicon micromachining. Distortion- free, precise or very small micro-nanostructures enables extremely sensitive and quick response sensors. Packaged, capacitive and integrated sensors were fabricated. Electrostatic force balancing sensors and resonant sensors performed wide dynamic range and high sensitivity respectively. Novel micromachining techniques developed and applied for the sensors were vacuum packaging, distortion-free anodic bonding, deep RIE, XeF₂ silicon etching, thickness monitoring during silicon etching, silicon nano-wire growth by electric field evaporation using UHV STM etc.

Citation Download Citation

Masayoshi Esashi, Takahito Ono, and Kazuyuki Minami "Precise micronanomachining for advanced sensors", Proc. SPIE 3223, Micromachining and Microfabrication Process Technology III, (5 September 1997); https://doi.org/10.1117/12.284499

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