Paper
5 September 1997 Single-sided multilevel structure for silicon pressure transducers by masked-maskless etching technology
Heng Yang, Jianjun Ren, Minhang Bao, Shaoqun Shen
Author Affiliations +
Proceedings Volume 3223, Micromachining and Microfabrication Process Technology III; (1997) https://doi.org/10.1117/12.284479
Event: Micromachining and Microfabrication, 1997, Austin, TX, United States
Abstract
A novel singled-sided multilevel island-beam-diaphragm structure has been designed and fabricated for an extremely high sensitivity pressure transducers by using a novel anisotropic etching technology called masked-maskless anisotropic etching technology. The structure consists of two small islands for overrange protection, two shallow masses for stress concentration, three thin beams on a deep-etched thin diaphragm for piezoresistors location. A prototype pressure transducer of 400 pa operation range and 0.6% nonlinearity has been tested.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Heng Yang, Jianjun Ren, Minhang Bao, and Shaoqun Shen "Single-sided multilevel structure for silicon pressure transducers by masked-maskless etching technology", Proc. SPIE 3223, Micromachining and Microfabrication Process Technology III, (5 September 1997); https://doi.org/10.1117/12.284479
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Cited by 1 scholarly publication and 1 patent.
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KEYWORDS
Transducers

Etching

Silicon

Anisotropic etching

Prototyping

Structural design

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