Shorter failure analysis using a new application of IDDQ for defect localization in ICs

Romain Desplats; Bertrand Fougnie; Philippe Perdu; Jamel Benbrik; Francois Marc; Yves Danto

doi:10.1117/12.324368

28 August 1998 Shorter failure analysis using a new application of IDDQ for defect localization in ICs

Romain Desplats, Bertrand Fougnie, Philippe Perdu, Jamel Benbrik, Francois Marc, Yves Danto

Proceedings Volume 3510, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV; (1998) https://doi.org/10.1117/12.324368
Event: Microelectronic Manufacturing, 1998, Santa Clara, CA, United States

Abstract

Recent progress with I_DDQ testing has demonstrated the ability to identify a majority of defects in logic ICs. I_DDQ testing has also been integrated in fault simulators embedded with automatic test pattern generation algorithms to further extend defect coverage. However, this progress has not eliminated the complex task of defect localization on the silicon level of ICs. Duration and accuracy of localization have a direct impact on the cost of failure analysis. Faster, better localization means shorter failure analysis and turn around time which in turn impacts the yield and reliability of IC production lines. To respond to this challenge, a new application of I_DDQ tests has been developed to accelerate the localization task and to directly impact IC production yields and reliability. In this paper, we will present a novel voltage contrast method for high speed defect localization. Using the same test pattern as that used to identify a faulty circuit, the equipotential line of the failure can be located using only a failed circuit. Comparing the equipotential line with the fault simulator output, the site of the simulated defect corresponding to the physical failure can be extracted, and local deprocessing with a FIB can be used on the failed circuit to physically reveal the defect with an improved turn around time.

Citation Download Citation

Romain Desplats, Bertrand Fougnie, Philippe Perdu, Jamel Benbrik, Francois Marc, and Yves Danto "Shorter failure analysis using a new application of IDDQ for defect localization in ICs", Proc. SPIE 3510, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (28 August 1998); https://doi.org/10.1117/12.324368

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