Paper
19 March 1999 Characterization of active thermographic system performance
Steven M. Shepard, Tasdiq Ahmed
Author Affiliations +
Abstract
The decision to use Thermographic Nondestructive Testing (TNDT) for a particular application is frequently made on an empirical basis using flat bottom hole test samples. In many cases, results are interpreted using subjective, non- quantitative criteria that cannot be generalized to apply to a broader range of applications. Although sensitivity is generally considered an important indicator of TNDT system performance, subsurface spatial resolution is rarely discussed. We present a methodology for TNDT system performance characterization that is loosely modeled on the Modulation Transfer Function (MTF) used in visual imaging. Once a TNDT system has been characterized using this approach, system performance for other applications can be accurately predicted. Examples including a steel resolution target and flat bottom holes in a CMC panel are discussed.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Steven M. Shepard and Tasdiq Ahmed "Characterization of active thermographic system performance", Proc. SPIE 3700, Thermosense XXI, (19 March 1999); https://doi.org/10.1117/12.342306
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CITATIONS
Cited by 6 scholarly publications.
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KEYWORDS
Modulation

Modulation transfer functions

Spatial frequencies

Imaging systems

Spatial resolution

Nondestructive evaluation

Silicon carbide

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