Paper
21 May 1984 Some Aspects Of Anti-Reflective Coating For Optical Lithography
Yi-Ching Lin, Vic Marriott, Kevin Orvek, Gene Fuller
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Abstract
One major limitation in optical lithography is the resist linewidth variation across steps on a highly reflective substrate. This problem can be alleviated by using an anti-reflective (AR) coating on a planarized multilayer resist surface. A spin-on AR coating provides a simple and economical approach for this purpose. However, the curing of the AR coating is a critical process step. An insufficient bake can result in undesirable undercut of the AR coating, while over baking leads to incomplete development. The coated AR thickness, the baking conditions, the exposure dose, and the development process, among others, interact in a complicated manner to impact the patterning accuracy of the resist/AR layers. In this paper, some aspects of the AR coating will be investigated to address the process complexity. Key interactive parameters will be identified, and a guideline to improve the process latitude will be given.
© (1984) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yi-Ching Lin, Vic Marriott, Kevin Orvek, and Gene Fuller "Some Aspects Of Anti-Reflective Coating For Optical Lithography", Proc. SPIE 0469, Advances in Resist Technology I, (21 May 1984); https://doi.org/10.1117/12.941774
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CITATIONS
Cited by 5 scholarly publications and 4 patents.
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KEYWORDS
Antireflective coatings

Photoresist materials

Autoregressive models

Reflectivity

Optical lithography

Photoresist processing

Polymethylmethacrylate

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