Laser resistance of fused silica for microlithography: experiments and models

Johannes Moll; Paul G. Dewa

doi:10.1117/12.474564

30 July 2002 Laser resistance of fused silica for microlithography: experiments and models

Johannes Moll, Paul G. Dewa

Proceedings Volume 4691, Optical Microlithography XV; (2002) https://doi.org/10.1117/12.474564
Event: SPIE's 27th Annual International Symposium on Microlithography, 2002, Santa Clara, California, United States

Abstract

Laser resistance of fused silica, used as lens material in DUV microlithography, is one of the keys to long-term high-level optical performance of steppers and scanners. The exposure of fused silica to high energy excimer laser pulses over long periods of time modifies the material in several different ways: the optical absorption increases due to laser-induced formation of color centers; the density of the material changes due to structural relaxation and formation of (beta) -hydroxyl (SiOH); and finally the index of refraction changes due to a photorefractive effect. All of these effects affect the imaging quality of illuminator systems and projection lenses, hence the need for fundamental understanding and modeling.

Citation Download Citation

Johannes Moll and Paul G. Dewa "Laser resistance of fused silica for microlithography: experiments and models", Proc. SPIE 4691, Optical Microlithography XV, (30 July 2002); https://doi.org/10.1117/12.474564

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