Paper
30 August 2004 Progress in DRS production line for uncooled focal plane arrays
Chien J. Han, Christopher G. Howard, Philip E. Howard, Adrian C. Ionescu, Chuan C. Li, John C. Monson, Robert L. Naranjo, Myron J. Scholten, R. Michael Sweeney, Roger L. Strong, William Sullivan, Towfik H. Teherani
Author Affiliations +
Abstract
To improve its capacity to meet customer needs, DRS Infrared Technologies began technology transfer of the VOx uncooled FPA process from its Anaheim facility to its Dallas facility in the Fall of 2002. The new facility delivered its first U3000 arrays (320x240, 51μm pitch) three months after the VOx deposition system was installed, and produced over 300 units of U3000 per month just twelve months after beginning the transfer. Process enhancements and tool upgrades have enabled excellent control of the microbolometer process. Today, this line selectively fabricates arrays with NETD varying from 30mK to 80mK in 15mK bins with less than 30 ms time constant. The same arrays also have low defect density of less than 2% dead pixels and no more than one row and one column out. The arrays are packaged in imager or radiometer (F/1.4) packages. DRS also transferred small and large format arrays with 25μm pitch under the PEO-Soldier Sensor Producibility to the Dallas facility. Production of the 25μm pitch devices is currently more that 100 units per month and is ramping up to meet customer demand. This paper reports on production progress on the U3000s and the status of U3500 and U6000 25μm pitch array.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Chien J. Han, Christopher G. Howard, Philip E. Howard, Adrian C. Ionescu, Chuan C. Li, John C. Monson, Robert L. Naranjo, Myron J. Scholten, R. Michael Sweeney, Roger L. Strong, William Sullivan, and Towfik H. Teherani "Progress in DRS production line for uncooled focal plane arrays", Proc. SPIE 5406, Infrared Technology and Applications XXX, (30 August 2004); https://doi.org/10.1117/12.563836
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Cited by 2 scholarly publications.
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KEYWORDS
Semiconducting wafers

Staring arrays

Microbolometers

Sensors

Packaging

Infrared technology

Infrared sensors

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