Paper
26 April 2006 Low temperature electrical properties of some Pb-free solders
Ryszard Kisiel, Marek Pekala
Author Affiliations +
Proceedings Volume 6159, Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments IV; 61591T (2006) https://doi.org/10.1117/12.675092
Event: Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments IV, 2005, Wilga, Poland
Abstract
The electronic industry is engaged in developing Pb-free technologies for more than ten years. However till now not all properties of new solders are described. The aim of the paper is to present some electrical properties of new series of Pb-free solders (eutectic SnAg, near eutectic SnAgCu with and without Bi) in low temperature ranges 10 K to 273K. The following parameters were analyzed: electrical resistivity, temperature coefficient of resistance and thermoelectric power. The electrical resistivity at temperatures above 50 K is a monotonically rising function of temperature for Pb-free solders studied. The electrical resistivity of the Bi containing alloys is higher as compared to the remaining ones. The thermoelectric power values at room temperature are about -8 μV/K to -6 μV/K for Pb-free solders studied, being higher as compared to typical values -3 μVK of SnPb solder. The relatively low absolute values as well as the smooth and weak temperature variation of electrical resistivity in lead free solders enable the possible low temperature application. The moderate values of thermoelectric power around and above the room temperature show that when applying the solders studied the temperature should be kept as uniform as possible, in order to avoid spurious or noise voltages.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ryszard Kisiel and Marek Pekala "Low temperature electrical properties of some Pb-free solders", Proc. SPIE 6159, Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments IV, 61591T (26 April 2006); https://doi.org/10.1117/12.675092
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KEYWORDS
Thermoelectric materials

Bismuth

Lead

Resistance

Temperature metrology

Copper

Electrons

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