Fabrication method for chip-scale-vacuum-packages based on a chip-to-wafer-process

J. Bauer; D. Weiler; M. Ruß; J. Heß; P. Yang; J. Voß; N, Arnold; H. Vogt

doi:10.1117/12.865019

27 October 2010 Fabrication method for chip-scale-vacuum-packages based on a chip-to-wafer-process

J. Bauer, D. Weiler, M. Ruß, J. Heß, P. Yang, J. Voß, N, Arnold, H. Vogt

Proceedings Volume 7834, Electro-Optical and Infrared Systems: Technology and Applications VII; 78340S (2010) https://doi.org/10.1117/12.865019
Event: SPIE Security + Defence, 2010, Toulouse, France

Abstract

This paper introduces a simple vacuum packaging method which is based on a Chip-to-Wafer process. The MEMS-device is provided with an electroplated solder frame. A Si-lid with the same solder frame is mounted on each die of the wafer using a flip chip process. The same materials for lid and substrate are used in order to reduce the mechanical stress due to the same thermal coefficients of expansion. The resulting cavity between die and lid can be evacuated and hermetically sealed with an eutectic soldering process. The feasibility of the method is demonstrated with an infrared focal plane array (IR-FPA). In this case, the Si-lid acts as an optical window and contains an anti reflective layer for the 8-14 μm wavelength area on both sides. The long-term vacuum stability is supported by a getter film inside the package. This method simplifies the sawing process and has the additional cost benefit that it is possible to package only known good dies.

Citation Download Citation

J. Bauer, D. Weiler, M. Ruß, J. Heß, P. Yang, J. Voß, N, Arnold, and H. Vogt "Fabrication method for chip-scale-vacuum-packages based on a chip-to-wafer-process", Proc. SPIE 7834, Electro-Optical and Infrared Systems: Technology and Applications VII, 78340S (27 October 2010); https://doi.org/10.1117/12.865019

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available