Paper
16 May 2011 A miniature pressure sensor for blast event evaluation
Author Affiliations +
Abstract
Traumatic brain injury (TBI) is a great potential threat to people who deal with explosive devices. Protection from TBI has attracted more and more interest. Great efforts have been taken to the studies on the understanding of the propagation of the blast events and its effect on TBI. However, one of the biggest challenges is that the current available pressure sensors are not fast enough to capture the blast wave especially the transient period. This paper reports an ultrafast pressure sensor that could be very useful for analysis of the fast changing blast signal. The sensor is based on Fabry-Perot (FP) principle. It uses a 45º angle polished fiber sitting in a V-groove on a silicon chip. The endface of the angle polished fiber and the diaphragm which is lifted off on the side wall of the V-groove form the FP cavity. The sensor is very small and can be mounted on different locations of a helmet to measure blast pressure simultaneously. The tests were conducted at Natick Soldier Research, Development, and Engineering Center (NSRDEC) in Natick, MA. The sensors were mounted in a shock tube, side by side with the reference sensors, to measure a rapidly increased pressure. The results demonstrated that our sensors' responses agreed well with those from the electrical reference sensors and their response time is comparable.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Nan Wu, Wenhui Wang, Ye Tian, Christopher Niezrecki, and Xingwei Wang "A miniature pressure sensor for blast event evaluation", Proc. SPIE 8029, Sensing Technologies for Global Health, Military Medicine, Disaster Response, and Environmental Monitoring; and Biometric Technology for Human Identification VIII, 80290V (16 May 2011); https://doi.org/10.1117/12.884278
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KEYWORDS
Sensors

Fiber optics sensors

Fiber optics

Silicon

Traumatic brain injury

Polishing

Microelectromechanical systems

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