A review on carbon-based materials as on-chip interconnects

Hatef Sadeghi; Jean-Michel Redouté; Daniel T. H. Lai; M. T. Ahmadi; Razali Ismail

doi:10.1117/12.903196

23 December 2011 A review on carbon-based materials as on-chip interconnects

Hatef Sadeghi, Jean-Michel Redouté, Daniel T. H. Lai, M. T. Ahmadi, Razali Ismail

Proceedings Volume 8204, Smart Nano-Micro Materials and Devices; 82042O (2011) https://doi.org/10.1117/12.903196
Event: SPIE Smart Nano + Micro Materials and Devices, 2011, Melbourne, Australia

Abstract

Interconnect wires are major technology components of modern high-speed integrated circuits. To overcome the latter's degradation caused by increasing miniaturization, there is an urgent need to look for alternative technologies. Since carbon based materials generate promising results, this paper focuses on describing the electrical properties of carbon based materials, in particular the use of graphene nanoribbon (GNR) as well as trilayer graphene nanoribbon (TGN) as next generation interconnects: since the conductance of TGN is less affected by external fields compared to GNR, it forms an improved choice for on-chip interconnects. The conductance model of TGN is derived and discussed in detail.

Citation Download Citation

Hatef Sadeghi, Jean-Michel Redouté, Daniel T. H. Lai, M. T. Ahmadi, and Razali Ismail "A review on carbon-based materials as on-chip interconnects", Proc. SPIE 8204, Smart Nano-Micro Materials and Devices, 82042O (23 December 2011); https://doi.org/10.1117/12.903196

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