Paper
24 June 2014 Mercury cadmium telluride implanted junction profile measurement and depth control
Songmin Zhou, Chun Lin, Haibin Li, Yanfeng Wei, Zhenhua Ye, Ruijun Ding, Li He
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Abstract
In this work, a novel junction profile measurement method is proposed. A serial of junctions were fabricated by B+ implantation. Then a beveled bar which was about 10mm long and several micrometers deep was formed by carefully controlled wet-etching. The remaining depth of n region changes from the full depth that is about 5.3mm after ion implantation to zero depending on its lateral position and the slope of the etching bar. Voltage-current and Laser Beam Induced Current (LBIC) measurements were applied to determine the HgCdTe junction edge. The LBIC signal orrectification characteristic indicates the existence of a PN junction. The junction depth is extracted from the position where the PN junction disappears and the slope of the etching bar. The junction depth of intrinsic doped HgCdTe was measured, which is about 2.4μm. A significant 0.4mm thick N-region was observed. Moreover, junction depths of samples annealed for different time were also investigated. By this method, it’s possible to measure the three dimensional profile of a planar PN junction.
© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Songmin Zhou, Chun Lin, Haibin Li, Yanfeng Wei, Zhenhua Ye, Ruijun Ding, and Li He "Mercury cadmium telluride implanted junction profile measurement and depth control", Proc. SPIE 9070, Infrared Technology and Applications XL, 907031 (24 June 2014); https://doi.org/10.1117/12.2050100
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Cited by 1 scholarly publication.
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KEYWORDS
Mercury cadmium telluride

Etching

Annealing

Chemical species

Ions

Mercury

Resistance

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