Application of holographic interferometry to in-plane and out-of-plane misalignment and deformation measurements in packaging applications

Vladimir V. Nikulin; Rahul Khandekar; Vijit Bedi

doi:10.1117/12.2182306

14 May 2015 Application of holographic interferometry to in-plane and out-of-plane misalignment and deformation measurements in packaging applications

Vladimir V. Nikulin, Rahul Khandekar, Vijit Bedi

Author Affiliations +

Proceedings Volume 9489, Dimensional Optical Metrology and Inspection for Practical Applications IV; 94890J (2015) https://doi.org/10.1117/12.2182306
Event: SPIE Sensing Technology + Applications, 2015, Baltimore, MD, United States

Abstract

Packaging of electronic and photonic components requires high accuracy, which needs to be verified in the process of manufacturing and testing. Since very small misalignments and/or deformations can lead to unacceptable performance, a measurement approach is needed that would reveal displacements as small as a few tens of nanometers or less. In addition, misalignments and deformations occur both in the out-of-plane and in-plane directions, which may be very difficult to separate from each other. It was previously demonstrated that the two types of measurements can be implemented with different approaches: holographic interferometry for out-of-plane and Moiré interferometry for in-plane, but it is very desirable to have a single system with sufficient accuracy in both lateral and longitudinal directions. An optical technique developed by our group and presented in this paper is based on a holographic approach and combines the principles of holographic interferometry and phase modulating adaptive optics that could provide in-plane and out-of-plane measurements with high accuracy.

Citation Download Citation

Vladimir V. Nikulin, Rahul Khandekar, and Vijit Bedi "Application of holographic interferometry to in-plane and out-of-plane misalignment and deformation measurements in packaging applications", Proc. SPIE 9489, Dimensional Optical Metrology and Inspection for Practical Applications IV, 94890J (14 May 2015); https://doi.org/10.1117/12.2182306

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available