Simultaneous 3d characterization and repair of EUV mask defects

Sang-Joon Cho; Byoung-Woon Ahn; Ah-Jin Jo; Brian Grenon; Yong-Woon Lim; Seung Yeon Sung; Dongchun Lee; Stefan Kaemmer

doi:10.1117/12.2688715

22 November 2023 Simultaneous 3d characterization and repair of EUV mask defects

Sang-Joon Cho, Byoung-Woon Ahn, Ah-Jin Jo, Brian Grenon, Yong-Woon Lim, Seung Yeon Sung, Dongchun Lee, Stefan Kaemmer

Proceedings Volume PC12751, Photomask Technology 2023; PC127510K (2023) https://doi.org/10.1117/12.2688715
Event: SPIE Photomask Technology + EUV Lithography, 2023, Monterey, California, United States

Abstract

As semiconductor processes have been developed into nanometer-level processes, the transition from photo- to EUV-processes has accelerated for nano-pattern production. In line with this trend, the need for analytical techniques of sub-nanometer defects in 3D shapes and chemical components is significantly increasing. Correcting various types of defects in the EUV process becomes essential. We have developed defect characterization and defect-repairing techniques using nano-machining and AFM technology for the EUV and optical photomasks. The defects identified in the mask are primarily divided into a soft defect, which occurs during the process and sits randomly in the mask, and a hard defect, which mainly indicates a damaged or altered pattern. Based on the inline AFM system introduced as semiconductor inspection equipment, I would like to introduce the potential technologies to analyze the 3D shape and mechanical and chemical properties of defects occurring at the EUV or photomasks.

Conference Presentation

Citation Download Citation

Sang-Joon Cho, Byoung-Woon Ahn, Ah-Jin Jo, Brian Grenon, Yong-Woon Lim, Seung Yeon Sung, Dongchun Lee, and Stefan Kaemmer "Simultaneous 3d characterization and repair of EUV mask defects", Proc. SPIE PC12751, Photomask Technology 2023, PC127510K (22 November 2023); https://doi.org/10.1117/12.2688715

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