Errata: Design-specific variation in pattern transver by via/contact etch process: full-chip analysis

Valeriy Sukharev; Ara Markosian; Armen Kteyan; Levon Manukyan; Nikolay Khachatryan; Jun-Ho Choy; Hasmik Lazaryan; Henrik Hovsepyan; Seiji Onoue; Takuo Kikuchi; Tetsuya Kamigaki

doi:10.1117/1.3314279

1 January 2010 Errata: Design-specific variation in pattern transver by via/contact etch process: full-chip analysis

Valeriy Sukharev, Ara Markosian, Armen Kteyan, Levon Manukyan, Nikolay Khachatryan, Jun-Ho Choy, Hasmik Lazaryan, Henrik Hovsepyan, Seiji Onoue, Takuo Kikuchi, Tetsuya Kamigaki

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Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 9, Issue 1, 019801 (January 2010). https://doi.org/10.1117/1.3314279

This PDF file contains the errata for “JM3 Vol. 9 Issue 01 Paper 3314279” for JM3 Vol. 9 Issue 01

©(2010) Society of Photo-Optical Instrumentation Engineers (SPIE)

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Valeriy Sukharev, Ara Markosian, Armen Kteyan, Levon Manukyan, Nikolay Khachatryan, Jun-Ho Choy, Hasmik Lazaryan, Henrik Hovsepyan, Seiji Onoue, Takuo Kikuchi, and Tetsuya Kamigaki "Errata: Design-specific variation in pattern transver by via/contact etch process: full-chip analysis," Journal of Micro/Nanolithography, MEMS, and MOEMS 9(1), 019801 (1 January 2010). https://doi.org/10.1117/1.3314279

Published: 1 January 2010

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