Ultraviolet laser ablation patterning of oxide films for optical applications

Jürgen Ihlemann

doi:10.1117/1.1904602

1 May 2005 Ultraviolet laser ablation patterning of oxide films for optical applications

Jürgen Ihlemann

Author Affiliations +

Optical Engineering, Vol. 44, Issue 5, 051108 (May 2005). https://doi.org/10.1117/1.1904602

Abstract

Deep-UV (248 nm, 193 nm) excimer laser ablation is used to pattern thin oxide films or layer stacks. The ablation of extended areas as well as submicrometer structuring is possible. Due to their optical, chemical, and thermal stability, these inorganic films are better suited for optical applications compared to organic films, especially if UV transparency is required. The ablation of SiO₂, Al₂O₃, HfO₂, and Ta₂O₅ layers and combinations is investigated. Patterned films can be used as masks, diffractive phase elements, or gratings.

©(2005) Society of Photo-Optical Instrumentation Engineers (SPIE)

Citation Download Citation

Jürgen Ihlemann "Ultraviolet laser ablation patterning of oxide films for optical applications," Optical Engineering 44(5), 051108 (1 May 2005). https://doi.org/10.1117/1.1904602

Published: 1 May 2005

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