GaN-based high-power laser diodes (LDs) have attracted tremendous interests in next-generation lighting applications, such as laser display, car laser light. However, high injection current usually brings inevitable drawbacks, including the well-known efficiency droop, Auger recombination and self-heating which obstruct further improvements of GaN-based optoelectrical devices. In this paper, influence of hole overflow at high injection current in an asymmetric GaN-based highpower blue LD has been comprehensively investigated and successfully suppressed by employing a new sandwiched GaN/AlGaN/GaN lower quantum barrier (GAG-LQB). Systematical simulations and measurements of structural and optical properties are carried out. As a result, the V-shaped defects induced by thick n-InGaN waveguide layer are apparently eliminated, which provides a more growth-friendly platform for deposition of the rest epitaxial layers and thus a better crystalline quality is obtained. On the other hand, the modified LD exhibits better photo-electrical properties with slope efficiency (SE) increasing from 0.98 to 1.24 and wall-plug efficiency (WPE) increasing from 18.7% to 20.5% at a high current of 1.5 A and no obvious efficiency droop is observed at a current as high as 2 A compared with the conventional one, because the middle-inserted AlGaN layer could form an extra barrier on the valence band to weaken the hole overflow and enhance the radiative recombination. Furthermore, the in-plane compressive strain induced by InGaN quantum wells (QWs) is also partially compensated by the tensile strain induced by the AlGaN layer. Therefore, the piezoelectric fieldinduced polarization is effectively alleviated and the wavelength blueshift is reduced from 7 nm to 1.6 nm.
To improve the heat management of high-power diode lasers, a microchannel heat sink is obtained, whose structure is optimized in method of numerical simulation. Following such a design, the microchannel heat sink is fabricated by nickel-based doping rare earth materials by laser three-dimensional (3-D) printing procedure. Since the noncorrosion property of such material has been preliminarily demonstrated by salt spray test, there is no necessity to plate the interior of the laser 3-D printing microchannel heat sink with gold. The coefficient of thermal expansion of such material is 11 ppm/K. The diode laser array (LDA) with 80-W cw output power, 2-mm cavity length, 100-μm emitter width, and 20% fill-factors is mounted on it for the thermal resistance test, and the result is 0.40 K/W. Moreover, the smile effect of the mounted LDA is merely 0.8 μm.
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