We propose a novel methodology employing deep photonic networks comprising cascaded Mach-Zehnder Interferometers (MZIs) to illustrate the proficiency of on-chip polarization handling. By applying gradient-based optimization techniques to tailor specific phase profiles within successive layers of MZIs, we demonstrate the functionality of devices adept at power division in both polarization-dependent and polarization-independent modalities. In silico simulations underscore the cutting-edge performance metrics achieved, encompassing a bandwidth exceeding 120 nm centered at 1550 nm, an extinction ratio surpassing 15 dB, and transmission bands characterized by flat-top profiles. These results prove the comprehensive capabilities of our deep photonic network ecosystem in polarization management, thereby unveiling promising prospects for advanced optical applications necessitating versatile polarization handling capabilities.
Using a highly-scalable and physics-informed design platform with custom Mach-Zehnder interferometers (MZIs), we design and experimentally demonstrate a 1 × 2 wideband duplexer on silicon operating within 1450-1630 nm. The device is constructed from six layers of cascaded MZIs whose geometries are optimized using an equivalent artificial neural network, in a total timeframe of 75 seconds. Experimental results show below 0.72 dB deviation from the arbitrarily-specified target response, and less than 0.66 dB insertion loss. Demonstrated capabilities and the computational efficiency of our design framework pave the way towards the scalable deployment of custom MZI networks in communications, sensing, and computation applications.
We propose a deep photonic interferometer network architecture for designing fabrication-tolerant photonic devices. Our framework incorporates layers of variation-aware, custom-designed Mach-Zehnder interferometers and virtual wafer maps to optimize broadband power splitters under fabrication variations. Specifically, we demonstrate 50/50 splitters with below 1% deviation from the desired 50/50 ratio, even with up to 15 nm over-etch and under-etch variations. The significantly improved device performance under fabrication-induced changes demonstrates the effectiveness of the deep photonic network architecture in designing fabrication-tolerant photonic devices, and showcases the potential for improving circuit performance by optimizing for expected variations in waveguide width.
In this study, we propose on-chip deep photonic networks with custom-designed Mach-Zehnder interferometers (MZI), allowing for the design of devices with arbitrarily defined dispersion profiles. We demonstrate a custom simulation and optimization framework to optimize dispersion and transmission profiles of these MZI-based networks. We experimentally show a proof-of-concept two-port photonic network with a highly nonintuitive, triangular dispersion profile in the C-band, while simultaneously achieving a flat band transmission with less than 0.7 dB insertion loss. We also demonstrate capabilities with multi-port photonic networks to enhance design freedom for customizable dispersion profiles, opening up new possibilities for on-chip dispersion engineering.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.