Dr. Chunsuo Xin Profile

Dr. Chunsuo Xin

at Harbin Institute of Technology

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Proceedings Article | 12 January 2009 Paper

Thermal expansion coefficient and electrical resistivity of nonuniform temperature specimen

Chunsuo Xin, Jingmin Dai, Qiang Wang, Xiaowa He

Proceedings Volume 7133, 71333F (2009) https://doi.org/10.1117/12.810482

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A new computing method is proposed for the measurement of the thermalphysical parameters of specimens with nonuniform temperature profile distributions. The calculation method is derived from the temperature dependence of the thermal properties, and can be applied to the measurement of the longitudinal thermal expansion coefficient and electrical resistivity. The cross section of the entire specimen is uniform at room temperature and the changes during the experiments are ignored in this method. If the temperatures are measured at equal intervals, the specimen may be considered as consisting of M equal segments and each of them is S long. The corresponding length and resistance of these segments at temperature T0 may be of any value. If the changes in length and temperature distribution of the specimen are measured, the temperature dependence of the thermal expansion coefficient can be worked out using this method. If the resistance and temperature distribution of the specimen are measured, the electrical resistivity versus temperature function of the specimen, which is corrected by thermal expansion, can be obtained as well. The validity of the computing method of thermal expansion coefficient and electrical resistivity is verified through computer simulation. The maximum 'measurement' error of electrical resistivity is 3.3%.

Proceedings Article | 12 January 2009 Paper

Experimental study on measurement accuracy of hot disk thermal constants analyser

Qiang Wang, Jingmin Dai, Chunsuo Xin

Proceedings Volume 7133, 71333E (2009) https://doi.org/10.1117/12.808950

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This work aims at the improvement of measurement accuracy of thermal conductivity and thermal diffusivity using a hot disk thermal constants analyser. The hot disk technique is based on the transient heating of a double spiral plane sandwiched between two pieces of investigated material. By researching the temperature change in the sensor surface, it is possible to deduce both the thermal conductivity and thermal diffusivity of the surrounding material from one single transient recording, provided the heating power and measuring time are appropriately chosen within the reasonable range defined by the theory and experimental situation. Based on the engineering application requirement for precision and efficacy, a new experimental method has been developed for high-accuracy measurement of thermal conductivity and thermal diffusivity in different experimental conditions. The standardized material Pyroceram 9606, with a thermal conductivity of 4.05 W/(mK), has been investigated and analyzed using the newly developed method. The measurement results show that the precision 5% estimated for thermal conductivity and 4% for thermal diffusivity at or around room temperature and under normal pressure, which indicate that the newly developed method has led to the high-accuracy measurement of thermal conductivity and diffusivity.

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