Mr. Daniel Price Profile

Daniel Price

Applications Development Engineer at KLA

SPIE Involvement:

Author

Area of Expertise:

Pattern Inspection , EUV , ADC , Data Management , Data Analytics , Reticle Manufacturing

Profile Summary

Applications Development Engineer for the Reticle Decision Center in KLA MACH.

Publications (2)

Proceedings Article | 12 November 2024 Presentation + Paper

Comprehensive EUV fab data management solution bridging reticle and wafer inspections

Alice Fu, Howard Lin, Calvin Hung, Bing-Rui Li, Ellis Lu, Jerry Hsieh, Brandon Hurt, Ryan Carlson, Xinya Liu, Masaki Satake, Derui Li, Will Wang, Wallace Wang, Brian Du, Daojing Li, Yao Zhang, Zeyu Lei, Narayani Narasimhan, Daniel Price, Vikram Tolani

Proceedings Volume 13215, 1321509 (2024) https://doi.org/10.1117/12.3033686

KEYWORDS: Reticles, Semiconducting wafers, Defect inspection, Wafer inspection, High volume manufacturing, Extreme ultraviolet, Scanning electron microscopy, Extreme ultraviolet lithography, Printing, Manufacturing

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Proceedings Article | 1 December 2022 Paper

Comprehensive extreme ultraviolet blank defect avoidance system

Brandon Hurt, Ryan Carlson, Yao Zhang, Xiaochun Yang, Masaki Satake, Yifu Wang, Derui Li, Vikram Tolani, Daniel Price

Proceedings Volume 12292, 122920C (2022) https://doi.org/10.1117/12.2642401

KEYWORDS: Photomasks, Extreme ultraviolet, Inspection, Reticles, Extreme ultraviolet lithography, Manufacturing, Semiconducting wafers, Scanning electron microscopy, Printing, Databases

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