5G networks are currently being deployed around the world, introducing a new era in machine-to-machine communications and reinforcing the Internet of Things. The 5G radiofrequency bands range from sub-1 GHz to 70 GHz, while the 6th generation (6G) is expected to cover bands at hundreds of GHz. There is a need for devices with high frequency performance and scalable manufacturing using inexpensive techniques and materials. Herein we present ZnO-based Schottky diodes, processed from solution on wafer scale with high yield. Coplanar nanogap electrodes are fabricated using a high-throughput low-cost technique, named adhesion lithography. The diodes’ cutoff frequency exceeds 100 GHz.
Nanoscale optoelectronic devices based on coplanar nanogap electrodes, when compared with traditional vertical devices, exhibit attractive characteristics, such as high density of integration, high sensitivity, fast response and multifunctionality. Moreover, their low-cost high-throughput fabrication on flexible disposable substrates opens up several new applications in sectors ranging from telecommunications and consumer electronics to healthcare - to name a few. However, their commercial exploitation has been hitherto impeded by technological bottlenecks, owing to the incompatibility of currently available fabrication techniques, eg. e-beam lithography, with industrial upscaling.
Adhesion lithography is a nanopatterning technique that allows the facile high yield fabrication of coplanar metal electrodes separated by a sub-15 nm gap on large area substrates of any type, including plastic. These electrodes, when combined with solution-processed and/or low-dimensional nanostructured materials deposited at low, plastic-compatible, temperatures give rise to nanoscale optoelectronic devices with intriguing properties.
It will be shown that both nanoscale light-emitting and light-sensing devices can be fabricated upon using light-emitting polymers along with self-assembling surface modifiers, and lead halide perovskites and functionalised colloidal PbS quantum dots, respectively. Emphasis will be given in recent advances in flexible nanoscale photodetectors fabricated with nanogap coplanar electrodes, operating in DUV up to NIR part of the spectrum. These devices exhibit high responsivity, sensitivity and fast response speed (hundreds of nanoseconds) owing to the extreme downscaling of key device dimensions. These results demonstrate that adhesion lithography combined with advanced materials concepts constitutes a new fabrication paradigm enabling a plethora of advanced applications within the field of flexible electronics.
The commercial interest in Radio Frequency Identification (RFID) tags keeps growing, as new application sectors, spanning from healthcare to electronic article surveillance (EAS) and personal identification, are constantly emerging for these types of electronic devices. The increasing demand for the so-called “smart labels” necessitates their high throughput manufacturing, and indeed on thin flexible substrates, that will reduce the cost and render them competitive to the currently widely employed barcodes.
Adhesion Lithography (a-Lith) is a novel patterning technique that allows the facile high yield fabrication of co-planar large aspect ratio (<100,000) metal electrodes separated by a sub-20 nm gap on large area substrates of any type. Deposition of high mobility semiconductors from their solution at low, compatible with plastic substrates, temperatures and application of specific processing protocols can dramatically improve the performance of the fabricated Schottky diodes.
It will be shown that in this manner both organic and inorganic high speed diodes and rectifiers can be obtained, operating at frequencies much higher than the 13.56 MHz benchmark, currently employed in passive RFID tags and near filed communications (NFC). This showcases the universality of this method towards fabricating high speed p- and n-type diodes, irrespective of the substrate, simply based on the extreme downscaling of key device dimensions obtained in these nanoscale structures. The potential for scaling up this technique at low cost, combined with the significant performance optimisation and improved functionality that can be attained through intelligent material selection, render a-Lith unique within the field of plastic electronics.
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