Mr. Dong-Jin Shim Profile

Dong-Jin Shim

Postdoctoral Associate at Massachusetts Institute of Technology

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Proceedings Article | 22 July 2003 Paper

Characteristics of solder joints under fatigue loads using piezomechanical actuation

Dong-Jin Shim, S. Mark Spearing

Proceedings Volume 5045, (2003) https://doi.org/10.1117/12.497949

KEYWORDS: Photomicroscopy, Inspection, Adhesives, Reliability, Manufacturing, Polishing, Microelectronics, Ceramics, Testing and analysis, Microscopes

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Crack initiation and growth characteristics of solder joints under fatigue loads are investigated using piezomechanical actuation. Cracks in solder joints, which can cause failure in microelectronics components, are induced via piezoelectricity in piezo-ceramic bonded joints. Lead-zirconate-titanate ceramic plates and eutectic Sn-Pb solder bonded in a double-lap shear configuration are used in the investigation. Electric field across each piezo-ceramic plate is applied such that shear stresses/strains are induced in the solder joints. The experiments show that cracks initiate in the solder joints around defects such as voids and grow in length until they coalesce with other cracks from adjacent voids. These observations are compared with the similar thermal cycling tests from the literature to show feasibility and validity of the current method in investigating the fatigue characteristics of solder joints. In some specimens, cracks in the piezo-ceramic plates are observed, and failure in the specimens generally occurred due to piezo-ceramic plate fracture. The issues encountered in implementing this methodology such as low actuation and high processing temperatures are further discussed.

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