KEYWORDS: Design and modelling, 3D modeling, Visualization, Copper, Advanced packaging, 3D applications, Integration, Design rules, Connectors, 3D vision
With the continuous improvement of system performance and integration, the previous circuit design ideas based on PCB have gradually failed to meet the needs of system miniaturization, low cost and rapid development. SiP technology can integrate multiple bare dies or passive devices into a package to form a functional device. Compared with the traditional PCB technology, SiP technology has a strong advantage in volume, performance, confidentiality, the mature circuit module SiP, can be directly applied to the design of different models of products, greatly accelerates the development of the system. This paper briefly introduces the principles and related technologies of SiP design, and introduces the methods and steps of SiP design and simulation by using Mentor Graphics series software and considering related technology and manufacturability.
The sudden interference of highlighted objects in the field of view of infrared imagers causes the overall gray distribution of the image to shift to the highlighted region, leading to the decline of target recognition effect. In this paper, an infrared image processing algorithm which runs by FPGA is introduced. Through histogram statistics and gray value conversion, the infrared image is compressed and the image details are enhanced. Through the recognition and processing of the high gray value region in the histogram, the interference of highlighting can be suppressed, and a good effect has been achieved.
Power Integrity (PI) issues with the development of high-speed digital circuits, simulation is the best way to solve it. In this paper, the HyperLynx simulation software is used in the PCB design process, in order to optimize the schematic diagram design and guide the PCB layout and wiring. The method of verifying the correctness of PCB design in the simulation after wiring is also introduced. In the process of simulation, combined with the relevant theory of PI, according to the simulation results, the method of optimizing circuit design is proposed, and the simulation waveform is verified. The results show that PI simulation in PCB design is of great significance to improve PCB design quality.
In digital circuit design, the design defect of signal integrity is also the root of EMC problem. This paper introduces the mechanism of electromagnetic compatibility problem due to circuit signal integrity problem, based on the case analysis of a project circuit jamming satellite receiver frequency band, we used the method of combining actual measurement with signal integrity and electromagnetic compatibility simulation based on Hyperlynx software, to find the causes of the problem, and the solution and design improvement suggestions are given. The experimental results show that the problem of electromagnetic radiation interference has been effectively solved.
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