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Hyounggon Kim
at SAMSUNG Electronics Co Ltd
SPIE Involvement:
Author
Publications (1)
Proceedings Article | 21 August 2020 Presentation + Paper
Vision-based high speed wafer film thickness profile estimation with nonlinear regression
Proceedings Volume 11500, 115000K (2020) https://doi.org/10.1117/12.2566426
KEYWORDS: Data modeling, Semiconducting wafers, Metrology, Image processing, General packet radio service, Visual process modeling, Sensors, Chemical mechanical planarization, RGB color model
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