Dr. Jaime Bravo
SPIE Involvement:
Author
Area of Expertise:
Process Integration , Technology Development , OSAT , Foundry , Advanced Packaging , Nanomaterials
Websites:
Profile Summary

Jaime Bravo earned his B.S., M.S., and Ph.D. from the University of New Mexico, Department of Chemical Engineering. He worked on the catalytic properties of materials and their processing, self-assembly, nanomaterials, and micro-reactors for fuel cells.

Dr. Bravo has a broad range of experiences in semiconductor manufacturing and technology development. He started his career in 1998, working for Motorola's semiconductor manufacturing in Austin as a process engineer. He completed multi-million dollar contract negotiations for semiconductor development. His interest in learning and semiconductors has driven him to continually diversify his roles, including involvement and expertise in semiconductor process integration and development, semiconductor package integration and development, and overall technology development from process technology to design enablement. He makes data-driven decisions and believes in positive team dynamics and high-performance teams. He has contributed to the publication of eight semiconductor patents, one novel material processing patent, and seven peer-reviewed papers in scientific journals. He has trained numerous engineers individually and has taught courses in data analysis and defect detection in manufacturing. Jaime joined the MOSIS team in 2020 to help expand an already world-class group.
Publications (2)

SPIE Journal Paper | 2 January 2024
Jaime Bravo, Philippe Morey-Chaisemartin, Eric Beisser, Frederic Brault, Joshua Zusman, Jimmy Lefevre, Lifu Chang
JM3, Vol. 23, Issue 01, 011003, (January 2024) https://doi.org/10.1117/12.10.1117/1.JMM.23.1.011003
KEYWORDS: Semiconducting wafers, Silicon, Electronic design automation, Reliability, Polymers, Image processing, Wafer bonding, Photomasks, Semiconductors, Packaging

Proceedings Article | 28 April 2023 Presentation + Paper
Jaime Bravo, Philippe Morey-Chaisemartin, Lifu Chang, Eric Beisser, Frederic Brault, Joshua Zusman
Proceedings Volume 12495, 1249511 (2023) https://doi.org/10.1117/12.2657011
KEYWORDS: Semiconducting wafers, Silicon, Polymers, Advanced packaging, Optical alignment, Electronic design automation, Wafer bonding, Polyimides, Reticles, Reliability

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