Mr. Jiunn Fang Profile

Jiunn Fang

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Proceedings Article | 27 June 2024 Paper

Enhancement and optimization of the propulsion system modules of unmanned aerial vehicles

Y. R. Shiau, J. Fang, Y. C. Huang

Proceedings Volume 13211, 1321108 (2024) https://doi.org/10.1117/12.3032425

KEYWORDS: Unmanned aerial vehicles, Design, Data modeling, Aerodynamics, Structural analysis, Wind speed, Analytical research

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Unmanned aerial vehicles (UAVs) are widely used in various industries. The present study focused on the optimization of the configuration of the vertical electric ducted fans (EDFs) of UAVs to enhance the vertical takeoff and landing (VTOL) performance of UAVs, improve the configuration of their propulsion system, address the potential risk of exposed propellers, and reduce the space required between the fluid channel and the outlet in horizontal EDFs. A UAV aircraft module with a vertical EDF configuration was designed, following which structural analysis and flow field analysis were conducted using Ansys. The results of these analyses indicate that the overall flow of the designed module is smooth and stable without vortex generation and that the inlet and outlet air velocity performance of this module is excellent. The lift parameters of the rotor groups of the designed module are identical to each other; thus, the flight stability of the UAV in the air can be maintained, and the requirements for optimized design can be met. This study makes two contributions to the literature. First, the structural module of a vertical EDF propulsion system was proposed with an encapsulated impeller set hidden inside the vehicle structure to reduce the risk of propeller exposure. Second, the configuration of vertical EDF compared to the horizontal configuration shortens the airflow channel, which helps to stabilize the wind speed at the outlet, thereby increasing lifting capacity and propulsion efficiency.

Proceedings Article | 25 October 2023 Paper

Design method for wafer dicing machine base based on calculations

Au-Zou Tai, Jiunn Fang

Proceedings Volume 12801, 1280166 (2023) https://doi.org/10.1117/12.3007488

KEYWORDS: Design and modelling, Wafer dicing, Vibration, Laser cutting, Semiconducting wafers, Deformation, Finite element methods, Semiconductors, Engineering

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In recent years, the role of semiconductor industry has become crucial for development in various countries. The semiconductor industry mainly consists of three parts: silicon material production, integrated circuit wafer manufacturing, and integrated circuit packaging. This paper focuses on the analysis of the cutting structure of the backend equipment wafer dicing machine in the integrated circuit packaging process. Currently, the mainstream wafer dicing machines utilize two types of cutting methods: laser cutting and mechanical cutting. While laser cutting is necessary for certain materials due to the generation of debris, mechanical cutting using diamond saw blades still offers significant cost savings. In order to achieve optimal design for mechanical wafer dicing machines, this paper presents a design process specifically tailored for such machines that used of mechanical cutting method, taking the example of a vibration-isolated base for a 6-inch wafer dicing machine.

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