Passive alignment of photonic components is an assembly method compatible with a high production volume. Its
precision performance relies completely on the dimensional accuracies of geometrical alignment features. A tolerance
analysis plays a key role in designing and optimizing these passive alignment features. The objective of this paper is to
develop a systematic approach for conducting such tolerance analysis, starting with a conceptual package design, setting
up the tolerance chain, describing it mathematically and converting the misalignment to a coupling loss probability
distribution expressed in dB. The method has successfully been applied to a case study where an indium phosphide (InP)
chip is aligned with a TriPleX1 (SiO2 cladding with Si3N4 core) interposer via a silicon optical bench (SiOB).
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