Dr. Karlheinz Bock Profile

Dr. Karlheinz Bock

at Fraunhofer EMFT

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Publications (2)

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Proceedings Article | 15 October 2012 Paper

Polymer opto-chemical-electronic based module as a detection system for volatile analytes on a foil substrate

Indranil Bose, Anna Ohlander, Matthias I. Stich, Christian Kiesl, Dieter Hemmetzberger, Gerhard Klink, Sabine Trupp, Karlheinz Bock

Proceedings Volume 8479, 84790C (2012) https://doi.org/10.1117/12.929821

KEYWORDS: Sensors, Dielectrics, Electroluminescence, Polymers, Gold, Light sources, Carbon, Crystals, Electrodes, Manufacturing

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In this paper, we report on a novel device that addresses the needs for an efficient, field deployable and disposable system in the field of bio-chemical sensors using organic semiconductors. The Fraunhofer Institute has enabled a complete roll-to-roll manufactured polymer-opto-chemical-electronic module on a foil substrate, wherein an electroluminescent light source has been hetero-integrated together with an organic TFT, working as a photo detector. A chemically sensitive, colour changing film is sandwiched in between the two elements to form an optical detection system for volatile analytes such as amines. The setup, henceforth referred to as the “PolyOpto” module, comprises of a dye coated layer that can detect specific chemical reactions by colour change inserted in between the EL light source and the OTFT photo-detector. A hole is laser cut through the system to allow the sensor layer to come in contact with the gases, which then through a chemical reaction, changes colour and initiates a different response in the output of the organic transistor. Hence, this allows for a disposable chemo-analytical system that can be used in various application fields. As compared to conventional systems, the advantage here lies in the direct integration of the different functionalities without any advanced assembly steps, simultaneous use of coatings for both components (transparent electrode and wiring layer) and roll-to-roll compatibility, thus rendering a disposable system. We believe that it aptly demonstrates the capabilities of polytronics in functional integration for low-cost bio-sensor manufacturing.

Proceedings Article | 19 April 2002 Paper

Packaging for MEMS devices: stumbling block or enabling solution?

Erik Jung, M. Wiemer, Volker Grosser, Karlheinz Bock, Juergen Wolf

Proceedings Volume 4755, (2002) https://doi.org/10.1117/12.462849

KEYWORDS: Packaging, Microelectromechanical systems, Semiconducting wafers, Sensors, Microelectronics, Manufacturing, Reliability, Wafer bonding, Ceramics, Metals

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MEMS devices may exhibit delicate structures sensitive to damage during handling or environmental influences. Their functionality may furthermore depend on sealing out the ambient or being in direct contact. Stress, thermal load or contaminations may change their characteristics. Here packaging technology is challenged to extend from microelectronics towards MEMS and MOEMS. Today's approaches typically rely on housing the miniature devices in bulky ceramic or metal casing or putting them into very high volume production-, benefiting from the microelectronics packaging infrastructure. Alternatively, besides focusing on available technology, device manufacturers develop individual packages for their product typically at high cost. While there is nowadays a good infrastructure for MEMS realization from universities to MEMS foundries, packaging still remains as a bottleneck at the end of the design cycle, sometimes stopping a device from being commercialized. Selecting the proper packaging method may tip the scale towards a product success and a product failure. Choosing the right technology therefore is not only a marginal work package but also a crucial part of the product design. Three approaches to be applied for MEMS/MOEMS devices will be presented and highlighted by examples. Single die packaging, die-to-wafer processes as well as wafer level packaging options are detailed with their individual benefits and challenges. Mechanical, fluidic and optical aspects are reflected in the package technologies selected for the individual examples presented. Accelerated testing of the packaged devices under actual conditions may also be a stumbling block; one example on an optical microsystem will showcase this issue, highlighting system response under different environmental loads.

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