Mr. Kun Cai Profile

Kun Cai

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Publications (1)

Proceedings Article | 22 February 2021 Presentation + Paper

Pattern-centric yield management approach with machine learning to detect and track defects with full chip coverage

Yu Zhang, Shirui Yu, Jiaqi Liu, Renyang Meng, Long Yin, Kai Wang, Kun Cai, Xingdi Zhang, Xinghua Song, Jiadong Ren, Abhishek Vikram, Changlian Yan, Guojie Cheng, Hui Wang, Qing Zhang, Wenkui Liao

Proceedings Volume 11614, 1161406 (2021) https://doi.org/10.1117/12.2583454

KEYWORDS: Scanning electron microscopy, Wafer inspection, Machine learning, Semiconducting wafers, Databases, Defect detection, Wafer-level optics, Image processing, Semiconductor manufacturing, Optical proximity correction

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