Teledyne Judson Technologies (TJT), a subsidiary of Teledyne Imaging Sensors (TIS), and a TIS team in California have jointly developed a low persistence InGaAs focal plane array (FPA) for use in TIS’s MicroCam SWIR camera. This FPA is built on the Hawaii-1RG (H1RG) read-out integrated circuit (ROIC) which has 1024x1024 pixels with an 18 μm pixel pitch format. Operated at 77 K, the newly developed InGaAs arrays achieve cumulative persistence values of ~0.04-0.08% after 45s of integration. This paper reviews the InGaAs detector design and fabrication processes and FPA test results of low persistence focal plane arrays. The persistence test methodology and test data are also presented. A unique epi-wafer and detector structure was designed to allow for low persistence, low dark current, low bad pixel count, high uniformity, and large reverse bias operation (1.5V). The FPA test data is presented for persistence, dark current, quantum efficiency (QE), and correlated double sampling (CDS) noise, as well as bad pixel count and clusters.
Mark Farris, Majid Zandian, Lisa Fischer, Sam Hoffman, Luis Gordillo, Wyatt Strong, Dennis Edwall, Erdem Arkun, Annie Chen, Eric Holland, Michael Carmody, John Auyeung, James Beletic
The Hawaii-4RG-15 (H4RG-15) Sensor Chip Assembly (SCA) is a 4096×4096 pixel sensor with 15 µm pixel pitch. The H4RG-15 is the newest SCA developed by Teledyne for low light level astronomical applications, providing larger format while retaining the low noise and low power of the H1RG and H2RG arrays with additional new features. The SCAs are currently being produced with mercury cadmium telluride (HgCdTe or MCT) detectors having cutoff wavelengths of 1.7 µm for near-infrared (NIR) and 2.5 µm for short-wave infrared (SWIR) applications. SCAs can also be produced with 5.3 µm cutoff wavelength for mid-wave infrared (MWIR) or optimized for visible only applications with hybrid silicon (HyViSI) detectors. Several science grade detectors have been delivered for use in new astronomical instruments. The H4RG-15 sensor has been developed to enable assembly of mosaics with high pixel fill factor, with a new package design that improves the butt-ability of the SCAs. The new package achieves a high level of flatness and is also appropriate for space flight missions, with assembly using flight qualifiable components.
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