Mr. Motti Penia Profile

Motti Penia

at KLA Israel

SPIE Involvement:

Author

Publications (1)

This will count as one of your downloads.

You will have access to both the presentation and article (if available).

DOWNLOAD NOW

This content is available for download via your institution's subscription. To access this item, please sign in to your personal account.

Email or Username Forgot your username?

Password Forgot your password?

Show

Keep me signed in

No SPIE account? Create an account

Proceedings Article | 27 April 2023 Poster + Paper

Advanced overlay metrology for 3D NAND bonding applications

Yoav Grauer, Shlomo Eisenbach, Motti Penia, Dror Elka, Arkady Simkin, Avner Safrani, Efi Megged

Proceedings Volume 12496, 124963D (2023) https://doi.org/10.1117/12.2660026

KEYWORDS: Wafer bonding, Semiconducting wafers, Metrology, 3D metrology, Optical parametric oscillators, Silicon, Optical alignment, Photovoltaics, Overlay metrology, Copper

Read Abstract +

3D heterogeneous integration is an evolving segment in integrated circuit development and advanced packaging to drive More than Moore (MtM) chip scaling. Heterogeneous integration allows IC manufacturers to stack and integrate more silicon devices in a single package, increasing the transistor density and product performance. Product designers seek to gain higher bandwidth, increased power, improved signal integrity, more flexible designs (mix/match different chip functions, sizes, and technology nodes), and lower overall costs. The 3D heterogeneous integration roadmap strives to reduce the bonding bumps/pads pitch to a sub-micrometer level, enabling a higher bump I/O density. Key process development activity is occurring in the wafer-to-wafer (W2W) bonding process to reduce interconnect pitch to 10μm and below. In the W2W process, a wafer bonder is used to align and bond two whole wafers. The bonded wafers are then cut up into stacked chips using a dicing process and undergo testing and further packaging. To successfully unite these two bond surfaces with a very small pitch, tight control of the bond pad alignment is required to make sure the copper pads to be bonded line up perfectly, driving an increased need for overlay metrology precision and die-bonder control. Overlay metrology challenges include thick silicon and tight overlay (OVL) error specifications to enable tight and fast on-product overlay (OPO) control for 3D NAND product development. This work will evaluate the various aspects impacting OPO, including the pre and post-bonding error budget, accuracy, measurability, robustness, and throughput.

My Library

You currently do not have any folders to save your paper to! Create a new folder below.

Folder Name

Folder Description

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks. You are receiving this notice because your organization may not have SPIE eBooks access.*

*Shibboleth/Open Athens users─please sign in to access your institution's subscriptions.

To obtain this item, you may purchase the complete book in print or electronic format on SPIE.org.

ORGANIZATIONAL
Sign in with credentials provided by your organization.

Organizational Username

Organizational Password

Show/Hide Password

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members:

Non-members: ADD TO CART

Keywords/Phrases

Search In:

Publication Years