Laser propulsion has gained increasing attention in the recent years. Ultra-high average power laser systems have emerged and found applications in launching satellites to the space. The impulse generated by ablation can also be used to move small parts. This article describes laser-induced releasing of microelectronic components from its carrier material. The releasing mechanisms can be divided in: ablative and thermal releasing, depending from polymers, which are used as the component's carrier material and whether low or high laser fluence is used. The directional variation and speed variations under different operating conditions were studied and presented. Application of this technique as a fast microelectronics components assembly method is demonstrated.
A new laser-assisted process called "Laser Die Transfer" is developed for high speed assembling of miniature electronic components. Silicon dies, fabricated on an optically transparent carrier are released using a laser pulse. This process has the potential to offer major advantages compared to existing transfer processes for future needs: high manufacturing speeds, contact-free, ability to handle very small and thin components. In this paper we present a thermal model, which describes the nonlinear behavior of silicon and carrier material under the influence of 1064 nm laser irradiation. The threshold intensities for die release and silicon damage will be explored as a function of operating laser beam characteristics. Experimental verification is presented to compare the simulated predictions and experimental results for the die release process.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.