Tungsten carbide (WC) offers high-strength, high-melting points, and exceptional toughness, with critical applications in industries such as optical molding. Precision machining of WC typically uses grinding operations where tool wear is a significant issue, especially for small geometries required for the consumer electronics industry. Single-point diamond turning (SPDT) is another option for precision machining small features but excessive tool wear prevents this from being a viable option. Innovative approaches, such as in-situ laser-assisted diamond turning, have demonstrated remarkable potential in alleviating tool wear issues and generating optical-quality surface finishes. Laser-assisted techniques, leveraging laser energy for ductile mode machining, mitigate material cracks or fractures. This study delves into the intricate relationship between diamond tool geometry, particularly the rake angle, and ductile regime machining dynamics. Precise selection of diamond tool geometry and rake angle is crucial for desired surface quality. The experimental setup involves specialized equipment like a UMT Bruker tribometer with a modified OPTIMUS system to investigate the impact of tool geometry, specifically the rake angle, in micro laser-assisted material removal on tungsten carbide. The goal is precise and controlled material micro laser-assisted ductile mode removal while minimizing damage or subsurface defects. Results highlight that the rake angle significantly influences the critical depth of cut, with a -25° rake angle proving advantageous, especially when combined with higher laser power. Laser power and tool geometry are pivotal parameters for optimizing hard and brittle material machining, offering valuable insights for precision engineering applications.
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