Demand for Immersion topcoat-less resist processes is being driven by the desire to reduce the cost per wafer pass.
Two key characteristics, required by high speed immersion scanners, of topcoat-less resist are high receding contact
angle and low leaching rates. The extremely hydrophobic surface required by the scanner provides significant
challenges to the remaining processing steps, especially (developer) process related defects: pattern collapse and
hydrophobic residuals. Recent developments in materials and processing techniques have led to very promising results.
In this paper the following will be presented:
Defectivity results on 45nm L/S of several topcoat-less resists, including the effects of optimized track rinse
recipes.
Results of a fundamental study on static contact angles changes of different topcoat-less resists after each
track process step to identify where in the process issues originate.
Imaging and defectivity results of 38nm L/S using the topcoat-less champion resist are presented. These
results illustrate the capability of the ASML TWINSCAN XT:1900i / Sokudo RF3i litho cluster of printing
38 nm L/S in a single exposure .
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