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Ryan Lee
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Publications (1)
Proceedings Article | 22 February 2021 Poster + Presentation + Paper
High contact angle embedded barrier layer materials for next-generation 193 immersion lithography
Joshua Kaitz, Mingqi Li, Ryan Lee, Amy Kwok, Thomas Cardolaccia, Amiel Evans, Choong-Bong Lee, Xisen Hou, Ke Yang
Proceedings Volume 11612, 116120U (2021) https://doi.org/10.1117/12.2583735
KEYWORDS: Polymers, Semiconducting wafers, Lithography, Water, Photoresist materials, Immersion lithography, Coating, 193nm lithography, Surface properties, Semiconductor manufacturing, Polymer chemistry
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